Capabilities

A complete product team under one roof.

Build complex physical and digital products without coordinating a chain of disconnected specialist vendors. One technical lead owns the decisions that cross discipline boundaries.

Engineers working with a collaborative robot arm

Disciplines that work together.

The right specialists around the problem — with no cracks between the physical and digital product.

Hardware & electronics

Hardware & electronics

  • System architecture
  • Schematic and PCB design
  • Sensor and power integration
  • Prototype build and bring-up
  • Compliance preparation
Firmware & embedded

Firmware & embedded

  • MCU and SoC firmware
  • Real-time systems
  • Drivers and protocols
  • Power optimisation
  • Secure OTA updates
Robotics & automation

Robotics & automation

  • Mechanical-electrical integration
  • Motion and control systems
  • ROS and autonomy
  • Industrial automation
  • Prototype machinery
AI & computer vision

AI & computer vision

  • Edge AI
  • Vision inspection
  • Prediction and optimisation
  • Custom model development
  • Production ML pipelines
Software & cloud

Software & cloud

  • Device and companion apps
  • IoT dashboards
  • Cloud infrastructure
  • Data platforms and APIs
  • Enterprise integrations
Prototyping & manufacturing

Prototyping & manufacturing

  • Rapid prototyping and assembly
  • 3D printing
  • Engineering documentation
  • Production samples and testing
  • Low-volume manufacturing

We join at the point of highest risk.

01

New product development

Turn an ambitious concept into a validated, manufacturable system.

02

Technical rescue

Diagnose stalled programs, redesign weak architecture and establish a credible recovery plan.

03

Innovation pilots

Test emerging technology against a real business case before committing to scale.

04

Product modernisation

Improve performance, connectivity, security or cost in an existing product.

Schematic to production.

Hardware depth handled by one team, with no handoff gaps between electronics, firmware and mechanical.

01

PCB design & layout

Multi-layer rigid and flex PCBs, high-speed design, RF and antenna optimisation, thermal management.

Up to 16 layersHDI & flex-rigid0.1 mm trace/space
02

Embedded systems

Firmware for ARM Cortex, ESP32, STM32 and FPGA-based systems with RTOS integration.

C / C++ / RustFreeRTOS / ZephyrLow-power design
03

Enclosure & mechanical

3D-printed prototypes, injection-moulding prep, IP-rated designs and thermal simulation.

IP67 / IP68CNC machiningSheet metal
04

Test jig development

Custom test fixtures, automated test systems and production-line integration.

Pogo-pin fixturesFlying probe readyICT / FCT
05

DFM optimisation

Design-for-manufacture review, BOM optimisation and component sourcing strategy.

Cost reductionLead-timeAlternate parts
06

Lab & validation

In-house lab for bring-up, debug, EMC pre-compliance and environmental checks.

200 MHz scope16-ch logic analyserEMC pre-compliance

In-house lab

  • 4-channel oscilloscope200 MHz, 2 GSa/s
  • Hot-air rework stationSMD / BGA capable
  • 3D printer farmFDM & resin
  • Pick & place machine0402+ components
  • Reflow ovenLead-free capable
  • Logic analyser16-channel
  • Spectrum analyser9 kHz – 3 GHz
  • EMC pre-compliance benchRadiated & conducted

Planning a program? Read the product engineering guide

Bring us the hard part.

Share the product, challenge or technical risk you are facing. We’ll come back with a clear technical next step — no sales pitch disguised as discovery.